Huawei brought some great Android smartphones to CES - the Huawei Ascend Mate shocked everyone with its gigantic 6.1-inch screen and the Huawei Ascend D2 made out of pure aluminum looked like a stront 5-inch 1080p offering. But while we expected the former to come out with Huawei’s rumored new chip, both handsets got the K3V2+ chip, a more powerful rendition of the K3V2.
However the new HiSilicon K3V3 is still coming up and Huawei plans on launching it in the second half of 2013 on devices that will succeed the Ascend Mate and D2.
The Chinese company also revealed that the design of the chip will be based on ARM’s Cortex A15 architecture rather than Cortex A9.
While the chip is gearing up for release in H2 2013, the actual successors to the Ascend Mate and D2 seem more likely to come in early 2014.
However the new HiSilicon K3V3 is still coming up and Huawei plans on launching it in the second half of 2013 on devices that will succeed the Ascend Mate and D2.
The Chinese company also revealed that the design of the chip will be based on ARM’s Cortex A15 architecture rather than Cortex A9.
While the chip is gearing up for release in H2 2013, the actual successors to the Ascend Mate and D2 seem more likely to come in early 2014.
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